Integrated Circuit Packaging
Integrated Circuit Packaging. In electronics manufacturing, integrated circuit packaging is the final stage of semiconductor device fabrication, in which the block of semiconductor material is encapsulated in a supporting case that prevents physical damage and corrosion. The package is what encapsulates the integrated circuit die and splays it out into a device we can more easily connect to.

Integrated Circuits are usually called ICs or chips.
If you aren't from the packaging world, then chances are likely you might think "packing" refers to objects being placed in to a box instead of packaging integrated circuits (IC's) on a substrate..
Integrated circuit packaging — Early USSR made integrated circuit Integrated circuit packaging is the final stage of semiconductor device fabrication per se, followed by IC testing. They are mostly available as dual in-line packages, metal cans and also ceramic flat packs. They are complex circuits which have been etched onto tiny chips of semiconductor (silicon).